The STCI-303 copper paste is applied to the MLCC products  and is applicable to the screen printing process. It shows good dispersion and printing characteristics. Good adhesion can effectively solve the cracking problem. It also shows good electrode continuity and flatness after sintering. It does not contain Pb, Cd and other harmful elements  (In accordance with RoHS 2.0 requirements).

a. STCT-201 is a copper paste suitable for small size (0201 size and below) X series MLCC terminal electrode;

 b. STCT-202 is a copper paste suitable for medium and large size (0402 size and above) x series MLCC terminal electrode; 

c. STCT-301 is a copper paste suitable for small size (0201 size and below) NP0 series MLCC terminal electrode; d. STCT-302 is a copper paste suitable for medium and large size (0402 size and above) X and NP0 series MLCC terminal electrode.

 It shows excellent characteristics by using the products. It will be formed a complete shape without any defect in dipping process. After sintering, dense copper layer will be built for preventing the invasion of Ni electroplating solution. The products could also reduce the frequency of pin-hole problem to improve the reliability of MLCC products.

STCT-101 is a low temperature cuting copper slurry product designed for application to the wexternal electrodes of MLCC with soft terminals.(0402 size and larger).
This series of products features complete terminal adhesion morphology without defects, and the soft terminal electrodes adhere firmly to the end electrodes, making them difficult to detach. The product also exhibits excellent bending resistance and strong reliability.